QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A

By Editorial Team

QuickLogic Corporation, a prominent developer of embedded FPGA (eFPGA) Hard IP and User Tools, has revealed a significant contract for implementing architectural enhancements for its eFPGA Hard IP optimized for Intel 18A technology. The mid-6-figure contract aims to incorporate enhancements that focus on reducing power consumption, enhancing performance, and minimizing silicon area for high-density eFPGA cores, applicable to advanced fabrication nodes.

Andy Jaros, the VP of IP Sales at QuickLogic, emphasized the company's commitment to collaborating closely with lead customers to identify and implement vital improvements essential for mutual success. The enhancements developed under the contract in 2025 have substantially improved power, performance, and area (PPA) metrics, positioning QuickLogic favorably to cater to the demands for high-density eFPGA cores in ASICs, SoCs, and large discrete FPGA requirements. This development expands the company's market reach and use-case applications, particularly in cost-sensitive scenarios.

For further details on QuickLogic's customized eFPGA solutions, including commercial, ruggedized, and radiation-hardened versions, inquiries can be directed to [email protected]

QuickLogic and its logo are registered trademarks of QuickLogic. All other trademarks belong to their respective owners.