New Arteris Solution Revolutionizes IP Reuse for Next-Gen Chips

The new Magillem Packaging solution builds upon Arteris’ long-standing expertise in IP-XACT-based design flows. By standardizing metadata and automating the generation of design files and configuration data, the tool ensures a high degree of consistency and compatibility between different components. This leads to reduced design errors, faster development cycles, and improved design predictability — key metrics for engineering teams racing to meet time-to-market pressures.

Arteris positions the Magillem Packaging product as a way to increase design efficiency and IP reuse, which has a direct impact on reducing silicon development costs. One of the product’s standout features is its ability to create and manage package-level descriptions that encapsulate chiplets and their interconnects, providing a scalable method to define multi-die systems from the architectural level.

“Magillem Packaging enhances the ability to work with a broad range of IP sources and chiplet-based designs by packaging them in a coherent and reusable format,” said company executives in the announcement. “This is crucial for the next generation of scalable SoCs and heterogeneous integration strategies.”

Moreover, Magillem Packaging complements existing EDA and design toolchains, allowing companies to leverage their current workflows while future-proofing their design processes. Its support for industry standards like IP-XACT and integration with the broader Arteris ecosystem further positions it as a plug-and-play enhancement for design teams across the semiconductor supply chain.

This launch underscores Arteris' commitment to streamlining semiconductor design and enabling innovation through modularity and reuse. As the industry moves toward disaggregated architectures and chiplet ecosystems, tools like Magillem Packaging will be central to maintaining consistency, traceability, and interoperability — all essential elements in ensuring the success of IP-based design strategies.